Author:
Smith D. A.,Psaras P. A.,Fishert I. J.,Tu K. N.
Abstract
AbstractPalladium has been deposited on {1001 and t1111 oriented silicon wafers and also on polysilicon. Cross-sectional specimens for transmission electron microscopy were prepared and heated in-situ. The interfaces between silicide and silicon were rough and the volume changes accompanying heating and compound formation caused elastic strains in the substrates and in one case hillock formation in the products.
Publisher
Springer Science and Business Media LLC
Cited by
3 articles.
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