Author:
Snodgrass J. M.,Hotchkiss G.,Dauskardt R. H.
Abstract
ABSTRACTTechniques are discussed for evaluating both critical interface adhesion values as well as the sub-critical debond behavior of polymer/silicon and polymer/polymer interfaces. Sub-critical debonding behavior is expected to be most relevant in predicting the in-service lifetime of microelectronic packages. Our research characterizes the debonding of a benzocyclobutene overlayer, as well as a technologically relevant epoxy underfill/polyimide/silicon interface system. Adhesion values are measured in a double cantilevered beam (DCB) and four-point bend fracture mechanics geometries by driving a stable debond along the relevant interfaces. The effect of temperature on subcritical debonding in an underfill/polyimide interface is described. Issues of crack path selection involving the selection of microstructurally weak paths in the layered system are considered.
Publisher
Springer Science and Business Media LLC
Cited by
10 articles.
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