Author:
Abelson J. R.,Maley N.,Doyle J. R.,Feng G. F.,Fitzner M.,Katiyar M.,Mandrell L.,Myers A. M.,Nuruddin A.,Ruzic D. N.,Yang S.
Abstract
ABSTRACTHigh quality a-Si:H films are deposited by d.c. magnetron reactive sputtering of a Si target in an (Ar + H2) plasma. This paper reports the first comprehensive understanding of the growth process. The incident flux, surface H coverage, H2 release, and bulk H incorporation are determined using four in situ, real time techniques: double modulation mass spectroscopy, isotope replacement experiments, reflection absorption infra-red spectroscopy, and spectroscopic ellipsometry. In addition, the sputtered particle transport is simulated using Monte-Carlo techniques. For conditions which produce electronic quality a-Si:H, the total H flux arriving at the surface varies between 0.5 – 2 times the depositing Si flux; approximately half of this flux appears to reflect from the surface without interaction. The growth surface has excess H varying between 0.5 – 2 × 1015/cm2, and this surface H coverage is uniquely related to the bulk H incorporation.
Publisher
Springer Science and Business Media LLC
Reference18 articles.
1. 18 Langford A. et al., in preparation.
2. 16. Katiyar M. , Feng G. , Abelson J. R. , and Maley N. , in diese proceedings.
3. Surface hydrogen release during the growth of a‐Si:H by reactive magnetron sputtering
4. 10. Myers A. M. , PhD diesis, U. Illinois at Urbana-Champaign, 1991.
5. Sputtered material
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献