Author:
Teplin Charles W.,Branz Howard M.,Jones Kim M.,Romero Manuel J.,Stradins Paul,Gall Stefan
Abstract
AbstractDuring the last few years, hot-wire chemical vapor deposition (HWCVD) has been explored as a low-temperature process for epitaxially thickening c-Si seeds layers on low cost substrates. Here, we demonstrate HWCVD epitaxy on thin polycrystalline silicon seed layers on borosilicate glass substrates. The crystal Si seeds are large-grained (~10 µm) polycrystalline silicon that were fabricated by Al-induced crystallization of a-Si. We report the growth of 0.5 µm of epitaxy at ~670°C.
Publisher
Springer Science and Business Media LLC
Cited by
2 articles.
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