Author:
Porter Cole,Laser Allan,Ratliff Christopher
Abstract
ABSTRACTFast-ramp small-batch vertical furnace technology improves batch furnace processing capabilities. Reducing cycle time and improving diffusion control while still maintaining a low cost of ownership and film thickness uniformity are the key benefits of this new technology. A new high power density furnace has been designed to accommodate accelerated wafer temperature ramp up and cool down rates. Unique quartz fixturing is also used to minimize thermal stress across the wafers. This paper will describe both thermal uniformity and film uniformity results for a 65Å Gate Oxide Process for the Rapid Vertical Processor (RVP). In addition, thermal stress data and throughput results will be presented.
Publisher
Springer Science and Business Media LLC
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