Stress-induced formation of structural defects on the {311} planes of silicon
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Published:1994-08
Issue:8
Volume:9
Page:2057-2065
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ISSN:0884-2914
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Container-title:Journal of Materials Research
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language:en
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Short-container-title:J. Mater. Res.
Author:
Weng-Sieh Z.,Krulevitch P.,Gronsky R.,Johnson G.C.
Abstract
Structural defects occurring on the {311} planes of single crystal silicon have been observed near the bottom oxide corner in silicon-on-insulator structures formed by selective epitaxial growth. These {311} defects exhibit a preferential orientation and are clustered near the silicon/silicon dioxide interface. This new observation provides an opportunity to study the mechanism of {311} defect generation in a system with discernible microstructure and stress state. High resolution electron microscopy combined with analytical and numerical three-dimensional stress modeling are used to show the dependence of these {311} defects on the local stress field, and to establish their origin in terms of a homogeneous dislocation nucleation model.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
2 articles.
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