Use of Thermodynamic Data to Determine Surface Tension and Viscosity of Metallic Alloys

Author:

Tanaka Toshihiro,Hack Klaus,Hara Shigeta

Abstract

During the last three decades, various thermodynamic databases have been compiled to be applied mainly to the calculation of phase diagrams of alloys, salts, and oxides. The accumulation and assessment of thermodynamic data and phase-equilibrium information to establish those databases is sometimes called the CALPHAD (calculated phase diagram) approach. The CALPHAD approach has been recognized as useful in various aspects of materials science and engineering. In addition to the use of thermodynamic databases for the calculation of phase diagrams, it would be very desirable to apply them to the calculation of other physicochemical quantities, such as surface tension. By doing this, not only can the Utility of databases be enlarged, but also a deeper understanding of the physical properties in question can be reached.On the basis of the concepts just mentioned, we have applied those thermodynamic databases to the calculation of the surface tension of liquid alloys and molten ionic mixtures. In these calculations, we have applied Butler's equation for the surface tension of liquid alloys. In addition, we have modified Butler's equation to be extended to molten ionic mixtures by considering the relaxation structure in the surface. These approaches will lead us to develop a multifunctional data-bank System that will be widely applicable in the evaluation of physicochemical properties of liquid alloys and molten ionic mixtures from thermodynamic data.In this article, we explain some physical modeis for the surface tension and viscosity of liquid alloys and molten ionic mixtures, in which thermodynamic data can be directly applied to evaluate these physical properties. In addition, the concept for the just-mentioned multifunctional thermodynamic data-bank System will be described by demonstrating the simultaneous calculation of phase diagrams, surface tension, and viscosity of some alloys used for new, Pb-free soldering materials.

Publisher

Springer Science and Business Media LLC

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,General Materials Science

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