Defect Structure and Crystallographic Texture of Polycrystalline Electrodeposits

Abstract

ABSTRACTThe polycrystalline electrodeposits of metals and alloys are characterized by exceptionally fine, equiaxed grain structure; the grain sizes two to four orders of magnitude smaller than those encountered in the bulk metals are generally obtained. Under the conditions of high cation discharge rate, twins accommodate interface growth; elongated grains and columnar morphology then become the common features. The dislocation density can be very high; the dislocations reside primarily as complex substructural configurations which are inherently unstable to thermal or mechanical stimuli. Vacancies, microvoids and vacancy/impurity complexes are endemic to deposits. The defect structure infrastructure (dislocation density and configuration, twinning frequency and hydrogen bubbles) is controlled by the deposition overpotential which also determines the preferred crystallographic texture. When the texture axis is parallel to the twin plane, anisotropie grain structure and columnar morphology are promoted; when the texture axis is perpendicular to the twin plane, a layered structure forms. The textured electrodeposit generates a duplex grain and subgrain structure. The random grains are small and defect saturated; the oriented grains are much larger and relatively free from crystal defects. The incidence of random grains, their size and defect concentration also depend upon the melting temperature of the metal.