Wafer Bonding Involving Complex Oxides

Abstract

AbstractThe present paper proposes a simple method which may be able to provide true single-crystal films of complex oxides on large substrates including semiconductors like silicon or gallium arsenide. The method describes a layer transfer process using layer splitting by hydrogen implantation and direct wafer bonding (DWB) to obtain single-crystal oxide films on different substrates. Alternatively, a fabrication process of ferroelectric-semiconductor heterostructures based on direct wafer bonding and layer transfer is also described. This process is an alternative method to the direct deposition of oxides films (ferroelectric, high-k) on silicon and allows fabrication of metal oxide-silicon heterostructures with an interface having a good structural quality as well as a low trap density.