Author:
Shih C. F,Chen W. T.,Cotterell B.,Lahiri S. K.,Zhang Y.W.
Abstract
ABSTRACTOne of the most important mechanical features in microelectronic packaging is the nterface. Recent developments in modelling interfacial fracture and the easurement of interfacial toughness relevant to microelectronic packaging are discussed.
Publisher
Springer Science and Business Media LLC
Cited by
3 articles.
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