Inductively-Coupled Plasma Nitriding of Fused Silica

Abstract

AbstractPlasma nitriding of fused silica has been performed over a temperature range of 750°C to 1300°C in a nitrogen-hydrogen plasma generated by an inductively coupled RF discharge. The plasma is used as both thermal and chemical source. The effects of various process parameters such as surface temperature, gas pressure and treatment time on total nitrogen content have been studied. The advantages and the drawbacks of this direct plasma nitriding technique are briefly discussed.