Author:
Gessert T. A.,Perkins C. L.,Asher S. E.,Duda A.,Young M. R.
Abstract
ABSTRACTThe present model for current transport at the CdTe/p-ZnTe:Cu/metal back contact assumes that the CdTe and ZnTe valence bands align, while current transport at a highly doped ZnTe and a metal interface proceeds by tunneling. To test part of this model, we have investigated the electrical and material properties of CdS/CdTe devices where the outer metal is either Ti or Ni. Our results show that differences in device series resistance are not linked simply to metal/ZnTe:Cu interfacial contact resistance, but that metallization-induced diffusion remains a more likely cause of significant performance distinctions.
Publisher
Springer Science and Business Media LLC
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献