Rapid Thermal Processing: Status, Problems and Options After the First 25 Years

Author:

Roozeboom Fred

Abstract

ABSTRACTThis paper reviews the current status, problems and options in RTP system and process design. Some commercial systems will be discussed along with some improvements that can still be made in temperature reproducibility, process control and yield. This includes some recent developments in temperature reproducibility by compensated emissivity control.Uniformity issues regarding temperature and process gas hydrodynamics are highlighted in relation to reactor design. Especially in CVD applications, where radiative heat transfer may not longer dominate convective and conductive heat transfer, modeling and visualization of gas flow patterns are becoming increasingly important. Here, reactor design should be such that a laminar flow regime is reached without turbulence and without chemical memory effects upon switching to other gas compositions. Some flow visualization results are illustrated.Some new options for micro- and nanocrystallization reactions are presented before we conclude with a technology roadmap to the 1-Gbit era.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference48 articles.

Cited by 23 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Heat Balance Evaluation for Rapid Thermal Processing System Design;Journal of The Electrochemical Society;2005

2. A Practical Design Method for a Rapid Thermal Processing System;Japanese Journal of Applied Physics;2004-02-10

3. A reduced-basis discretization method for chemical vapor deposition reactor simulation;Mathematical and Computer Modelling;2003-07

4. Nonempirical Design of Rapid Thermal Processing System;Japanese Journal of Applied Physics;2001-12-15

5. Design of a Rapid Thermal Processing System Using a Reflection-Resolved Ray Tracing Method;Journal of The Electrochemical Society;2001

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