Abstract
ABSTRACTThe advance of microelectronic devices has emphasized the important role of contact metallization. Contacts have become more and more complex in their structure. In this review we present some of our work on three different types of contact systems consisting of a unicomponent/bicomponent interface. The systems are: 1) alloy films (codeposited two metals) on Si, 2) a metal on Si1-xGex epilayers, and 3) a metal on a compound semiconductor (GaAs). Due to applied heat-treatments, competitive interfacial reactions take place between the various constituents of the contacts. These interfacial reactions can affects the properties of the contacts and their stability and reliability.
Publisher
Springer Science and Business Media LLC