Author:
Elliman R. G.,Lawn M. A.,Reeves G. K.,Jagadish C.
Abstract
ABSTRACTThin Ir films were deposited onto clean (111) Si surfaces. The films were analysed by Rutherford backscattering and transmission electron microscopy and were shown to be continuous for film thicknesses as small as 0.5nm. The films contained internal stress as deposited and coiled up when the substrate was removed chemically.A four point probe was employed to measure the resistivity of the films as a function of film thickness. The resistivity increased with decreasing film thickness, from ∼35 micro-Ohm. cm for 160nm thick films to -190 micro-Ohm. cm for 0.5nm thick films. This increase in resistivity is shown to be consistent with theories of carrier transport in thin films.
Publisher
Springer Science and Business Media LLC
Cited by
1 articles.
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