Influence of in-process copper incorporation on the quality of diamond-like carbon films deposited by pulsed laser deposition technique

Author:

Dikshit S. J.,Lele Pramada,Ogale S.B.,Kshirsagar S. T.

Abstract

Copper-incorporated carbon films have been prepared on Si(100) and Corning (7059) glass substrates by the pulsed excimer laser deposition technique using KrF radiation (λ = 248 nm). Cold-pressed composite pellets, having compositions from 2 at. % to 11 at. % copper in carbon, were used as targets for ablation. Good quality, scratch-proof films were obtained at a laser energy density of 2−3 J/cm2 and a substrate temperature of 50 °C. The films were characterized by x-ray diffraction (XRD), Raman spectroscopy, x-ray photoelectron spectroscopy (XPS), UV-visible spectrometry, ellipsometry, and four-point probe resistivity measurements. Under similar deposition conditions, films obtained from composite targets of lower copper concentration are seen to have better diamond-like character as compared to those obtained from a pure graphite target. At such low concentrations, copper is seen to cluster in the form of nanoparticles. As the copper concentration increases in the films, they tend to acquire disordered graphitic network with degraded DLC characteristics, and the size of copper agglomerates increases from about 5 nm (for the 2 at. % case) to 85 nm (for the 11 at. % case). It is seen that an increase in the copper content leads to modifications in the carbon network, additional interband transitions, and reduction of the band gap.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3