High Performance Silicone Gel as IC Device Chip Protection

Abstract

ABSTRACTRecent advances in IC device encapsulants and polymeric materials have made high reliability VLSI plastic packaging a reality. High performance silicone gel possesses excellent electrical and physical properties for IC protection. With their intrinsic low modulus and soft gel-like nature, silicone gels have become very effective encapsulants for the delicate larger chip size and wire-bonded VLSI chips. Recent studies indicate that adequate IC chip surface protection with high performance silicone gels in plastic packaging could possibly replace conventional ceramic: hermetic packaging. This paper will review some potential IC encapsulants. Special focus will be placed on the high performance silicone gel, its chemistry, and its application as a VLSI device encapsulant.