Novel Plasma Control Method in PECVD for Preparing Microcrystalline Silicon

Abstract

ABSTRACTA novel plasma enhanced vapor deposition (PECVD) technique employing biased wall (BW) method has been developed for the enhanced growth rate of the hydrogenated microcrystalline silicon (μc-Si:H) films. Using this method, we have achieved a growth rate of more than 6Å/sec for the formation of μc-Si-H having an average grain size of 200Å; at 350°C.