Gate contact materials in Si channel devices

Author:

Wen Huang-Chun,Chambers J.J.

Abstract

Abstract

Publisher

Springer Science and Business Media LLC

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,General Materials Science

Reference32 articles.

1. 20. Wen H.-C. , Choi K. , Lysaght P. , Majhi P. , Alshareef H. , Huffman C. , Harris R. , Luan H. , Lee B.H. , Yamada N. , presented at VLSI Technology, 2005. (VLSI-TSA-Tech). 2005 IEEE VLSI-TSA International Symposium on pp. 107–108, 2005.

2. 6. Wong C.Y. , “Doping of n+ and p+ polysilicon in a dual-gate CMOS process,” presented at Electron Devices Meeting, 2003.

3. Interfacial oxygen and nitrogen induced dipole formation and vacancy passivation for increased effective work functions in TiN/HfO2 gate stacks

4. High-κ gate dielectrics: Current status and materials properties considerations

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