Kinetics of Chemical Vapor Deposition of Sic Between 750 and 850°C at 1 Bar Total Pressure

Abstract

AbstractThe deposition rate from mixtures of methyltrichlorosilane (MTS), hydrogen and methane was measured thermogravimetrically using a hot wall vertical reactor and planar SiC substrates. Below 850 °C and at sufficiently high gas velocities, the rate of the phase boundary reaction could be determined. In the absence of CH4 and at H2 :MTS=55, Si was deposited together with SiC. Addition of CH4 lowered the Si content, pure SiC being deposited at CH4 :MTS above 10. The deposition rate j in the range 750 to 850 °C follows the equation with E(Si) = 160 and E(SiC) = 300 kJ/mol. Reaction mechanisms are presented to account for the observed reaction orders with respect to MTS. Between 900 and 970 °C, the reaction rate decreased with temperature indicating a change in the deposition mechanism.