Ceramics and Glass-Ceramics in Electronic Packaging

Abstract

ABSTRACTAn overview of ceramic packaging as it evolved over the last two decades from dual-in-line packages to state-of-the-art multilayer multichip packages ispresented. IBM's 69 layer glass-ceramic/copper multilayer multichip substrate with dielectric constant of 5.0, thermal expansion exactly matching silicon and exceptional dimensional control is summarized.