Stress Analysis of Titanium Dioxide Films by Raman Scattering and X-Ray Diffraction Methods

Abstract

AbstractTitanium dioxide films have been deposited onto glass substrates by dc reactive magnetron sputtering at different sputtering pressures (2×10−3 -- 2×10−2 mbar). The films have been characterized by measuring their Raman scattering and X-ray diffraction (XRD). The films stress have been calculated by analyzing their Raman spectra and X-ray diffraction spectra. Two methods give similar results which films prepared at low sputtering pressure have high stress values.