XPS Study of Buried Metal/Polymer and Polymer/Metal Interface

Abstract

ABSTRACTMetal/Polymer systems have potential applications as interconnect materials in integrated circuits. Polymers with low dielectric constants, if used as interlayer dielectric, can reduce the RC time constant. Device speed can be doubled if a polymer can replace the present dielectric material, SiO2. However, the problem of weak metal/polymer adhesion must be understood and resolved. In situ deposition and analysis are the most controlled means to study an interface formation process. However, for practical reasons, i.e., application, time, cost, and flexibility, it is critical to study metal/polymer interface ex situ. X-ray Photoelectron Spectroscopy (XPS), can be used to determine the composition and bonding structures of buried interfaces. This is achieved by examining peeled surfaces, thin overlayer, and lowenergy- ion sputtered surfaces. The possible adhesion mechanism or failure mode is determined by correlating XPS results with adhesion strength. Based on these results, adhesion enhancement methods, such as substrate surface treatments, can be formulated. The product of these treatments can be evaluated using the same analysis. These techniques for studying buried interfaces using XPS are reviewed and results of their applications to the metal/Teflon AF 1600 interface is presented.