Author:
McGroarty John,Yost Boris,Børgesen Peter,Li Che-Yu
Abstract
AbstractPassive alignment techniques using area array solder joints are currently under investigation as a cost effective method of achieving electro-optical interconnects in electronic packages. Several investigators have developed models that describe the shapes of and forces produced by the liquid solder drops during reflow. These models are reviewed to provide a scientific basis for the application of such techniques.
Publisher
Springer Science and Business Media LLC
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