Abstract
AbstractUsing a combination of x-ray diffraction and curvature measurements, the stress evolution during solid-state amorphization in a Ni-Hf diffusion couple has been monitored. In contrast to the Co-Hf system, no dissolution of Ni in Hf is observed. During interdiffusion, the growing amorphous layer develops a large tensile stress, which subsequently relaxes by creep. Irradiation of the diffusion couple leads to an increase in tensile stress, and a further increase following a subsequent anneal. Composition measurements by Rutherford backscattering spectrometry indicate absence of an effect of the stress variations on the effective interdiffusion coefficient.
Publisher
Springer Science and Business Media LLC
Cited by
1 articles.
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