Author:
Leclerc Gervais,Paquin Louis,Baratay Fabrice
Abstract
Oxide films are grown on a silicon wafer at low temperatures through the catalytic action of a thin gold film. Our results indicate that the oxide film thickness and morphology vary with the initial gold film thickness but do not significantly depend on the temperature. A Fourier analysis of the film structure suggests that the growth mechanism may include a spinodal decomposition where a binary alloy undergoes a phase separation. It is argued that gold silicide is the most likely candidate for spinodal decomposition.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
8 articles.
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