Compressive magnetostriction of FeSm alloy film

Abstract

AbstractThe compressive magnetostriction values of Fe2.4Sm alloy thin film prepared on silicon, copper and titanium substrates (300μm thickness) by direct current magnetron sputtering process were investigated. When the residual gas pressure before argon sputtering and the sputtering pressure of argon gas (5 N) were below 3.2×10−4 Pa and 2.0×10−1 Pa, respectively, the thickness of the Fe2.4Sm films deposited was about 3 μm. Compressive magnetostriction of Fe2.4Sm alloy film on titanium sheet generates the large bending motion, rather than those on silicon wafer and copper substrates. The high magnetostrictive susceptibility of the films was observed at low magnetic field.