Author:
Werder D.J.,Chen C.H.,Chen H.S.,Bacon D.D.
Abstract
This communication reports on the microstructure and interdiffusion observed in a new NbSn2/Nb metallization structure on SiO2, previously reported [H. S. Chen et al., Appl. Phys. Lett. 66, 2191 (1995)]. The as-deposited NbSn2 layer was found to be amorphous. After heating, the NbSn2 becomes polycrystalline and heavily diffused with Au from the Au-Sn solder. The Nb layer remains pure and intact after heating. The microstructure, compositions, and phases of the Au-Sn solder layer are also presented.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
4 articles.
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