Author:
Semboshi Satoshi,Konno Toyohiko J.
Abstract
The electrical conductivities of Cu–3at.%Ti alloys aged at 773 K in a hydrogen atmosphere were investigated as a function of aging time. The electrical conductivity of the quenched alloy, 5.2% International Annealed Copper Standard (IACS), improved with aging time to 66% IACS after 48 h. This was mainly caused by the dilution of the Cu–Ti solid solution in the alloy, which is supported by the fact that the lattice parameter of the face-centered cubic (fcc) phase approaches that of pure Cu by aging in a hydrogen atmosphere.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
51 articles.
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