Role of Kinetic Energy of Sputtered Particles in Thin Film Properties

Abstract

ABSTRACTThe thin film processes of the sputter deposition method have been reviewed with special emphasis on the effects of kinetic energy of sputtered particles and ion bombardment during deposition on thin film properties. An overview is first given to describe the thin film process and ion-surface interactions, where the methods of measuring the energy distribution of sputtered ions and the anisotropic-emission-effect sputter deposition are presented. Experimental results for Cr, SiO2 and Ni-Si-B films are presented, and the correlation between the structure and properties of the thin films is discussed. Research in modification of thin films by energetic atoms and ions is an exciting area of materials science in the future.