High-Performance Packaging of Power Electronics

Abstract

AbstractPackaging of solid-state power electronics is a highly interdisciplinary process requiring knowledge of electronics, heat transfer, mechanics, and materials science. Consequently, there are numerous opportunities for innovations at the interfaces of these complementary fields. This article offers a perspective of the current state of the art and identifies six specific areas for materials-based research in power electronics packaging. The emphasis is on identifying the underlying physical relationships that link the performance of the power electronics system to the microstructure and architectural arrangement of the constituents.