Ceramic-Polyimide Systems for Electronic Packaging-Reference-Cited by-同舟云学术

Ceramic-Polyimide Systems for Electronic Packaging

Published:1993 Issue: Volume:304 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Marsh Wayne E.,Kanakarajan K.,Osborn Garry D.

Abstract

AbstractA family of new high performance thermoplastic polyimide adhesives have been developed that can be directly laminated to ceramic substrates, polyimide films, metals, and/or sputter metallized for eventual circuit fabrication. We have also developed new heat-sealable composite polyimide films that have improved CTE, that have good dimensional stability and that can also be directly bonded to ceramic and glass-ceramic substrates. With these new material sets various constructions of ceramic-polyimide rigid-flex systems can be conceived to meet the more demanding needs of the electronics industry. We have laminated these films to metals and various ceramic substrates such as alumina, aluminum nitride, glass, etc. and investigated the bond stabilities under thermal and humidity aging conditions.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference4 articles.

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2. 4. Mattox D. M. , in 6th International SAMPE Electronics Conference, pp. 659–671, (June 1992).

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