Sustained Percolation in Stretched Silver Nanowire Networks for Stretchable Inter-Connection Applications

Author:

Park Jae Sung,Kim Woo Soo

Abstract

ABSTRACTHere we introduce a highly stretchable Printed Circuit Board (PCB) inter-connection technology achieved through the combination of flexibility allowed by the silver nanowire (AgNW)-based electrode and stretchability provided by the meander-shaped substrate. Horseshoe-shaped elastic material, polydimethylsiloxane, is used as a substrate of the AgNW conductors for relaxed stress concentration. Continuously maintained 2-D percolation of stretchable AgNW networks overcomes the usage restrictions with ordinary rigid Printed Circuit Board (PCB). The horseshoe-shaped inter-connection is physically reliable with repeated stretching/releasing processes and maintains its conductivity under tensile strains up to 20 %, allowing the durable and stretchable PCB inter-connecting applications.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

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