Low Resistance α-Ta Film For Large Area Electronic Devices

Abstract

ABSTRACTA New method of the low resistivity α-Ta deposition technique has been developed. The sputtered Ta film deposited on TaMo alloy has bcc structure (α-Ta) in contrast to tetragonal of the Ta mono layer (β-Ta), and shows the resistivity as low as 22μΩ cm. The mechanism of this transformation is not explained by simple epitaxial growth. X-ray diffraction analysis and RBS analysis indicated that the TaMo alloy layer, due to Mo diffusion from the under layer, acts as a seed plane of growth. The Ta/TaMo layered film is suitable for Large Area Electronic devices for its low resistivity.