Three-Dimensional Integration of Silicon Chips for Automotive Applications-Reference-Cited by-同舟云学术

Three-Dimensional Integration of Silicon Chips for Automotive Applications

Published:2006 Issue: Volume:970 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Weber Werner

Abstract

ABSTRACTCurrently, 3D integration of semiconductor chips is introduced into high-volume products. While memory and communication will be leading fields of application, automotive will require specific non-standard solutions some of which are in research or development whereas others have already been introduced to production. This paper elaborates on the different opportunities and constraints of automotive applications, presents different technological options and discusses specific solutions considered in research or found in already existing products.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

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