Vertical Integration: A Confederacy of Alignment, Bonding, and Materials Technologies-Reference-Cited by-同舟云学术

Vertical Integration: A Confederacy of Alignment, Bonding, and Materials Technologies

Published:2006 Issue: Volume:970 Page:
ISSN:0272-9172
Container-title:MRS Proceedings
language:en
Short-container-title:MRS Proc.

Author:

Farrens Shari

Abstract

ABSTRACTVertical or 3D integration is taking hold in both the CMOS IC industry and the MEMS industry. The need for smaller devices, lower power, increased functionality, and lower cost are driving the market toward chip and wafer level stacking. Equipment suppliers have been faced with numerous challenges to meet the demands of these emerging bonding applications. This paper will discuss the confederacy of alignment, bonding and materials unions that can lead to successful outcomes in integrated manufacturing.1. Alignment strategies for 3D integration: IR, BSA, and ISA as they pertain to specific bond methods2. Pros and Cons of 3D Bonding Techniques (Direct bonds, metal, adhesive, and eutectic)3. Error analysis in alignment of 3D structures

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference3 articles.

1. 2. Kwon Y. , Lu J-Q. , Gutmann R.J. , Kraft P.P. , McDonald J.F. and Cale T.S. , “Wafer bonding Using Low-K Dielectrics as Bonding Glue in Three-Dimensional Integration, The Electrochemical Society, 2001 Joint Meeting, September 2–7, 2001, San Francisco.

2. 3. Farrens S. and Hermanowski J. , “Lights-out MEMS Manufacturing”, Adv. Pkg., Aug/Sept 2006, p16–18.

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