Nanoscale Sn Inclusions in Al – Structure and Melting-Solidification Properties

Abstract

AbstractAl-Sn surface alloys with 2-3 at.% Sn have been made by ion implantation of Sn in Al. The microstructure of the alloys consists of dense distributions of nanoscale Sn inclusions embedded in the Al matrix. For implantations carried out at 425 K the inclusions have sizes in the range from about 2 to 15 nm. The structure of the inclusions is tetragonal - the white Sn structure – with lattice parameters of a = 0.583 nm and c = 0.318 nm respectively, i.e. identical to the lattice parameters of bulk Sn. The inclusions grow in preferred alignment with the matrix and the most commonly observed orientation relationships is given by (100)Sn ||(111)Al and [010]Sn || [211]Al. The shape of the inclusions is partly faceted and partly rounded with larger flat facets on the {100}Sn/{111}Al interfaces. Melting and solidification of the inclusions, which have been studied by in-situ transmission electron microscopy (TEM) and Rutherford backscattering spectrometry (RBS) in combination with channeling, shows a distinct hysteresis. Melting of the inclusions which is associated with a distinct premelting, takes place in the range from about 430 K to 485 K, i.e. significantly below the bulk melting point of 505 K. The premelting is size dependent and the smallest inclusions melt at the lowest temperatures. Solidification requires a substantial undercooling and takes place from around 400 K with a much weaker size dependence.