Copper-Matrix Molybdenum Particle Composite as a Low-Thernal-Expansion Conductor

Abstract

AbstractPowder metallurgical fabrication of Cu/Mo composites containing 33–73 wt.% Mo was carried out by using either Cu coated Mo powder or a mixture of Cu and Mo powders. The former yielded Cu/Mo composites of greater density, hardness, compressive yield strength and abrasive wear resistance, and lower electrical resistivity and coefficient of thermal expansion than the latter. This is attributed partly to the lower porosity of the former composites and partly to the separation of the adjacent Mo particles in the former composites and the partial linkage of the adjacent Mo particles in the latter composites.