On the Ohmic Contact Formation Mechanism in the Au/Te/N-GaAs System

Author:

Wuyts K.,Langouche G.,Vanderstraeten H.,Silverans R.E.,Van Hove M.,Van Rossum M.,Münder H.,Lüth H.

Abstract

ABSTRACTAlloyed Au/Te/n–GaAs ohmic contacts, with contact resistivities comparable to those of the AuGe device standard, have been developed and studied by Mässbauer spectroscopy, Raman scattering and X-Ray Diffraction. The formation of Au-doped Ga2Te3 crystallites, grown epitaxially on a defectively GaAs surface was observed. No evidence for the formation of an n++–GaAs surface layer could be derived. The interpretation of all experimental results leads to a description of the ohmic conduction mechanism based on a resonant tunneling process assisted by defect/impurity related deep levels through low barrier metal/Te/(Au)Ga2Te3/GaAs interfaces

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Reference16 articles.

1. [9] Wuyts K. , Langouche G. , and Silverans R.E. , Hyp. int. (in press) (1990)

2. Site Occupation of Implanted Te in Gaas As a Function of Implantation Dose

3. [10] Bemelmans H. , and Langouche G. (private communication)

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1. Annealing behavior of Au(Te)/n-GaAs contacts;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1993-05

2. Auger analysis of Ni/Au/Te and Au/Te Ohmic Contacts on n-GaAs;Surface and Interface Analysis;1992-06

3. Identification of the Ohmic-contact formation mechanism in the Au/Te/Au/GaAs system;Physical Review B;1992-05-15

4. The dopant and compound forming behavior of As and Au impurities in Ga2Te3;Journal of Applied Physics;1992-01-15

5. A Raman study of Au/Te/Au/GaAs (100) ohmic contacts;Journal of Applied Physics;1992-01-15

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