Theoretical Studies of Electromigration in Polycrystalline Metal Stripes

Abstract

AbstractA systematic analysis is presented of the mesoscopic mechanisms that govern the structural evolution of polycrystalline conductors under the action of applied electric fields. A recently derived set of general dynamical mesoscopic equations is specialized to study the behavior of microstructural building blocks. Scaling analysis is presented for the dynamics of the corresponding transport and micromechanical processes associated with a wide range of time scales. Results of numerical simulations are presented for vacancy migration along grain boundaries, evolution of current-induced stresses, surface diffusion, and void stability and growth. The calculated dependence of characteristic times on current density is discussed.