Measurement of Bond Strength at Metal/Ceramic Interfaces

Abstract

AbstractWe report on a novel method for measuring the bond strength of metal/ceramic interfaces. Test specimens are created by vapor depositing a metal film on a ceramic substrate. The specimen is impacted with a thin metal flyer sending a short planar shock pulse into the ceramic. If the shape and amplitude of the wave is properly controlled the interface will spontaneously debond creating new free surfaces.Measurements indicate the debonding process occurs in less than 1.0 ns, which we believe is too short for crack propagation along existing flaws. Therefore, we conclude that simultanious breaking of atomic bonds rather than propagation and coalescence of cracks is the means by which the film and substrate are separated. The free surface velocity of the metal overlayer is monitored during spall by laser interferometry. The data constitute a direct measurement of the bond strength. The measured bond strengths are reproducible and do not show a dependence on shock amplitude for identically prepared specimens.