Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference5 articles.
1. SRC Microelectronics and Advanced Packaging (MAPT), Roadmap, SRC (2023) https://srcmapt.org/. Accessed 30 Nov 2023
2. SIA/SRC Decadal Plan for Semiconductors, (SRC 2021) https://www.src.org/about/decadal-plan/. Accessed 14 Oct 2022
3. Y. Wu, H.N. Fowler, N. Weddington et al., Effect of sb and ag additions on the melting and solidification of Sn-Bi solder alloys. MRS Adv. (2023). https://doi.org/10.1557/s43580-023-00619-w
4. M. Malakoutian, R. Soman et al., Development of 300–400°C grown diamond for semiconductor devices thermal management. MRS Adv. (2023). https://doi.org/10.1557/s43580-023-00677-0
5. Y. Elasser, H. Li, Circuits and magnetics co-design for ultra-thin vertical power electronics: a snapshot review. MRS Adv. (2023). https://doi.org/10.1557/s43580-023-00724-w