Characteristics of tin whiskers formed on sputter-deposited films—an aging study

Author:

Winterstein J.P.,LeBret J.B.,Norton M.G.

Abstract

Tin whiskers formed on sputter-deposited films on Muntz metal substrates have been examined following long-term aging at room temperature. It was found that while the initial annealing conditions determined the original nucleation and growth rates, whisker nucleation and growth was a continuous process and appeared to be occurring throughout the duration of the study. Whisker densities increased for all samples during aging, and samples that initially showed no whiskers during high-temperature annealing had a population density of 2.5 mm−2 after storage for 15 months.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Modeling of lithium-whisker growth: Effect of mass transport into grain boundary;Journal of Energy Storage;2024-04

2. Tin Whiskers 101: 2019;2019 Pan Pacific Microelectronics Symposium (Pan Pacific);2019-02

3. A Nonlinear Viscous Model for Sn-Whisker Growth;Metallurgical and Materials Transactions A;2016-04-29

4. Sn whisker mitigation by a thin metallic-glass underlayer in Cu-Sn;Applied Physics Letters;2013-12-09

5. Interface flow mechanism for tin whisker growth;Acta Materialia;2011-03

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