Abstract
ABSTRACTThis paper reviews several laser-based area-selective processing techniques developed for high-density multichip interconnection applications. Key material and process requirements for the development of a viable laser-direct-write interconnect technique on polyimide are addressed.
Publisher
Springer Science and Business Media LLC
Reference19 articles.
1. Laser‐induced selective copper deposition on polyimide
2. 6. Eichelberger C.W. , Wojnarowski R.J. , Carlson R.O. , and Levinson L.M. , SPIE Symposium on Innovative Science and Tech. Paper 877-15 (January 1988).
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献