Measuring the Strength and Stiffness of Thin Film Materials by Mechanically Deflecting Cantilever Microbeams

Abstract

AbstractThe present authors recently introduced the mechanical deflection of cantilever microbeams as an experimental technique for measuring the strength and stiffness of thin films.[1] The technique utilizes conventional integrated circuit (IC) fabrication to process the samples, a Nanoindenter to deflect the cantilever beams mechanically, and simple elastic beam theory to analyze the data. This paper will review the technique and describe some of its current applications.