Novel ultra nanoindentation method with extremely low thermal drift: Principle and experimental results

Abstract

Despite active development over the past 15 years, contemporary nanoindentation methods still suffer serious drawbacks, particularly long thermal stabilization and thermal drift, which limit the duration of the measurements to only a short period of time. The presented work introduces a novel ultra nanoindentation method that uses loads from the μN range up to 50 mN, is capable of performing long-term stable measurements, and has negligible frame compliance. The method is based on a novel patented design, which uses an active top referencing system. Several materials were used to demonstrate the performance of the method. The measurements with hold at maximum load confirm extremely low levels of instrument thermal drift. The presented Ultra Nanoindentation Tester opens new possibilities for testing thin films and long-term testing, including creep of polymers at high resolution without the need of long thermal stabilization.