A Spectromicroscopic Study of Corrosion in AI-Cu-Si Metallization

Author:

Liang S.,Ray-Chaudhuri A.K.,Ng W.,Singh S.,Welnak J.T.,Cerrina F.

Abstract

AbstractSoft X-ray photoelectron spectromicroscopy has been employed to examine the microstructural chemistry of corrosion on thin films of AL-i%Cu-1%Si alloy. Cu-rich precipitates are formed after the film is annealed at around 320ºC Localized corrosion takes place around these precipitates, and circular microstructures have been observed. Energy distribution curves (EDCs) taken at specific points are analyzed and photoelectron images were obtained from different kinetic energies corresponding to the peaks in EDC. It was found that after corrosion the Al2Cu particles are revealed and distributed at the center of the corrosion structure with oxide as matrix, while the oxides form a ring-like band outside.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. In-Situ X-ray Photoemission Spectromicroscopy of Electromigration in Patterned Al-Cu Lines With Maximum;MRS Proceedings;1998-01

2. High resolution spectromicroscopy with MAXIMUM: Photoemission spectroscopy reaches the 1000 Å scale;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;1994-08

3. Status of soft X-ray photoemission microscopy utilizing synchrotron radiation;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1994-04

4. Study of surfaces and interfaces by scanning photoemission microscopy;Synchrotron Radiation News;1994-03

5. Microstructural Imaging of Localized Chemical Reactions using Valence Photoelectrons;MRS Proceedings;1994

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