On the Interface Properties and Deep Level Defects in Ta2O5 Grown on Si by Plasma Enhanced Liquid Source-Cvd

Abstract

AbstractWe report, for the first time, on interface properties of the Ta2O5-Si system and on the deep level defects in Ta2O5 grown by plasma enhanced liquid source chemical vapor deposition (PE-LS-CVD) using Ta(OC2Hs)5. The capacitance voltage (C–V) measurement performed on Au/Ta2O5/n, p-Si MOS diodes resulted in very well defined C-V charactristics which compares well with the ideal C-V curve. The flat band voltage is as low as 0.15 V and the minimum density of the interface state is about 2.7 × 1011 cm−2 ev−1. In order to examine deep level defects in Ta2O5, we investigated variations of flat band voltage under application of high stress electric field (10MV/cm), by which hot carriers are injected in to deep levels. This charge transfer process results in increase of charges in Ta2O5 oxide which is attributed to the equivalent deep level defect densities, which is found to be of the order of 2 × 1011 cm−2 in the Ta2O5-Si system. These results strongly suggest low interface states and deep levels in the PE-LS-CVD grown Ta2O5-Si system, which may be brought about by low decomposed-carbon impurities in the film, confirmed by AES in our previous reports. These films can play a vital role as thin capacitors in I.C. technology.