Area-Selective Laser Processing Techniques for Multichip Interconnect

Abstract

AbstractThe interest in laser processing technology has increased significantly in recent years because of increasing demands for application-specific IC design and fabrication, yield enhancement, circuit restructuring, and prototyping; all of these benefit from an adaptive processing technique using direct energy for improvement of precision, resolution, process automation, and turnaround time. This paper reviews several laser-patterned metallization techniques developed for high-density multichip interconnection applications. Key material and process requirements for developing a viable laser-direct-write interconnect technique on polyimide are addressed.