Abstract
ABSTRACTExperimental studies have shown that strains due to thermal expansion mismatch between a film and its substrate can produce very large stresses in the film that can lead to the formation of holes and hillocks. Based on a phenomenological description of the evolution of a solid surface under both capillary and stress driving forces and for surface and grain boundary self-diffusion, this article provides, for the first time, analytical and numerical solutions for surface profiles of model geometries in polycrystalline thin films. The results can explain a variety of surface morphologies commonly observed experimentally and are discussed to give some practical insights on how to control the growth of holes and hillocks in thin films.
Publisher
Springer Science and Business Media LLC
Cited by
3 articles.
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